Thermite® TVC-3.0 Model 1100
High Performance in Any Environment
The Thermite® TVC-3.0 Model 1100 offers state-of-the-art embedded computing, mobile graphics, and conduction cooling, delivering unparalleled graphics and processor performance for rugged battle field applications. The Thermite TVC-3.0 Model 1100 is perfect for high-performance computing, advanced graphics, shader-based rendering, and GPGPU processing in a compact form factor for any environment.
The Thermite TVC-3.0 Difference
The Thermite TVC-3.0 features a 1.6 GHz Intel® Core 2 Duo processor with a Nvidia® FX770M GPU for superior compute and graphics processing performance, making it ideal for performance rich applications in battlefield, ground, air and maritime environments.
Processing Powerhouse
The Thermite TVC-3.0 Model 1100 with a CUDA-capable GPU can handle accelerated GPGPU operations to solve complex compute-intensive applications in the most demanding of environments. The Thermite TVC-3.0 is perfect for field-based training, situational awareness, sensor processing/display, mission planning, mission rehearsal, weapon system control, maintenance, and other augmented reality simulations. CUDA is a general purpose parallel computing architecture that leverages the parallel compute engine in Nvidia graphics processing units to solve many complex computational problems in a fraction of the time required on a CPU. The fast parallel computing architecture is easily accessed using the most common programming languages in use today. The Thermite TVC-3.0 brings capabilities of the most powerful PC workstations to the battlefield—for deployment on Ground Vehicles, Aircraft, Maritime, or other vehicles.
- Aggressive Performance – Intel® Core 2 Duo LV processor and a CUDA-enabled GPU
- 3D Graphics – NVIDIA® Quadro® FX770M GPU for visual rich applications
- Power E fficient – Dynamic power control manages power consumption and thermal dissipation
- Versatile I/O – Built-in USB, RS-232, RS-422, and Gigabit Ethernet
- Rugged – Designed to work in the most demanding field environments
- Storage for your needs – Drive size and drive type to suit your needs
- Video Capture – Advanced PCIe-based video capture and processing options
Product Specs
CPU
Class: Core 2 Duo LV
Clock: 1.6 GHz
L2 Cache: Up to 4MB
Chipset: Intel 965GME “Santa Rosa” MCH, ICH8-M
System Memory
Capacity: 4GB dual-channel
Graphics Processor
Frame Buffer: 256MB DDR2 DRAM
GPU Module: 32-Core
Interface: PCIe x16
Operating System
Removable Storage
Standard Interfaces
VGA: 1
PCIe video capture: 1
RS-232C: 2
RS-422: 1 Asynchronous, 1 Synchronous (SDLC)
IEEE 802.3 10/100/1000 Ethernet: 1
Power/Performance
Standards: MIL-STD-704F, STANAG 1008 and MIL-STD 1275
Dimensions
Height: 160 mm (6.3 in)
Depth: 81.5 mm (3.2 In)
Weight: 4 kg (8.8 lbs)
Environmental
Humidity Level: 5% - 90%, NC (operating), 5% - 95%, NC (non-operating)
Altitude Level: -200 to 40,000 ft
Vibration Resistance: Up to 12 G RMS
Shock Resistance: Up to 40 G
Immersion Resistance: 1m for 30 minutes
Note: Subject to validation testing, and subject to change at any time.