Thermite® TVC-3.0 Model 1100

High Performance in Any Environment

The Thermite TVC-3.0 Model 1100 offers state-of-the-art embedded computing,
mobile graphics, and conduction cooling, delivering unparalleled graphics and
processor performance for rugged battlefield applications. The Thermite TVC-3.0 Model 1100 is perfect for high-performance computing, advanced graphics, shader-based rendering, and GPGPU processing in a compact form factor for any environment.

The Thermite TVC-3.0 Difference

The Thermite TVC-3.0 features a 1.6 GHz Intel® Core 2 Duo processor with a Nvidia® FX770M GPU for superior compute and graphics processing performance, making it ideal for performance rich applications in battlefield, ground, air and maritime environments.

Processing Powerhouse

The Thermite TVC-3.0 Model 1100 with a CUDA-capable GPU can handle accelerated GPGPU operations to solve complex compute-intensive applications in the most demanding of environments. The Thermite TVC-3.0 is perfect for field-based training, situational awareness, sensor processing/display, mission planning, mission rehearsal, weapon system control, maintenance, and other augmented reality simulations. CUDA is a general purpose parallel computing architecture that leverages the parallel compute engine in Nvidia graphics processing units to solve many complex computational problems in a fraction of the time required on a CPU. The fast parallel computing architecture is easily accessed using the most common programming languages in use today. The Thermite TVC-3.0 brings capabilities of the most powerful PC workstations to the battlefield—for deployment on Ground Vehicles, Aircraft, Maritime, or other vehicles.


  • Aggressive Performance – Intel® Core 2 Duo LV processor and a CUDA-enabled GPU
  • 3D Graphics – NVIDIA® Quadro® FX770M GPU for visual rich applications
  • Power Efficient – Dynamic power control manages power consumption and thermal dissipation
  • Versatile I/O – Built-in USB, RS-232, RS-422, and Gigabit Ethernet
  • Rugged – Designed to work in the most demanding field environments
  • Storage for your needs – Drive size and drive type to suit your needs
  • Video Capture – Advanced PCIe-based video capture and processing options

Tech Specs

  • CPU

    • Manufacturer: Intel
    • Class: Core 2 Duo LV
    • Clock: 1.6 GHz
    • L2 Cache: Up to 4MB
    • Chipset: Intel 965GME “Santa Rosa” MCH, ICH8-M

  • System Memory

    • Type: DDR2
    • Capacity: 4GB dual-channel

  • Graphics Processor

    • Processor: Nvidia® Quadro FX770 Graphics Module
    • Frame Buffer: 256MB DDR2 DRAM
    • GPU Module: 32-Core
    • Interface: PCIe x16

  • Operating System

    • Standard: Microsoft® Windows® XP Embedded

  • Removable Storage

    • Options: 128 GB Solid State Drive

  • Standard Interfaces

    • USB 2.0: 2
    • VGA: 1
    • PCIe video capture: 1
    • RS-232C: 2
    • RS-422: 1 Asynchronous, 1 Synchronous (SDLC)
    • IEEE 802.3 10/100/1000 Ethernet: 1

  • Power/Performance

    • Supply: 10-36VDC (10.5 - 30 volts DC) with Advanced power-saving technologies
    • Standards: MIL-STD-704F, STANAG 1008 and MIL-STD 1275

  • Dimensions

    • Width: 244 mm (9.6 in)
    • Height: 160 mm (6.3 in)
    • Depth: 81.5 mm (3.2 In)
    • Weight: 4 kg (8.8 lbs)

  • Environmental

    • Ambient Temperature: -25° C to +62° C (operating), -40° C to +85° C (non-operating)
    • Humidity Level: 5% - 90%, NC (operating), 5% - 95%, NC (non-operating)
    • Altitude Level: -200 to 40,000 ft
    • Vibration Resistance: Up to 12 G RMS
    • Shock Resistance: Up to 40 G
    • Immersion Resistance: 1m for 30 minutes
    • Note: Subject to validation testing, and subject to change at any time.

Let's Discuss Your Project Requirements